久久久精品色综合_人妻少妇精品无码专区啵多_久久在线偷拍视频这里只有精品_日韩精品无码区免费专区_韩国毛片视频免费观看网站

SU-8 2002 is best suited for permanent applications where it is imaged, cured and left on the device.
 It may also be exposed with e-beam or x-ray radiation.  

Upon exposure, crosslinking proceeds in two steps

 (1) formation of a strong acid during the exposure step, followed by 

(2) acid-catalyzed, thermally driven epoxy cross-linking during the post exposure bake (PEB) step.  A normal process is:  spin coat, soft bake, expose, PEB, followed by develop.  Substrate Preparation To obtain maximum process reliability, substrates should be clean and dry prior to applying SU-8 2002 resist. For best results, substrates should be cleaned with a piranha wet etch (using H2SO4 & H2O2) followed by a de-ionized water rinse.  Substrates may also be cleaned using reactive ion etching (RIE) or any barrel asher supplied with O2.  Adhesion promoters are typically not required. For applications that require electroplating it is recommended to pre-treat the substrate with MCC Primer 80/20 (HMDS). 
Features ?Improved adhesion ?Reduced coating stress ?High aspect ratio imaging ?Vertical sidewalls ?Greater than 100 μm film thickness in a single coat ?Excellent dry etch resistance